Request SampleGlobal Fab-Lite Market Growth (Status and Outlook) 2024-2030
SKU ID : LPI-28225969 | Publishing Date : 27-Sep-2024 | No. of pages : 109
The three types of semiconductor business model that define the design and the fabrication houses have been in use for several decades: Fabless, IDM, and Pure-Play Foundries. FAB-LITE Model Provides Low-Cost Solution For Semiconductor Dependent Companies Without Foundry To Enter Semiconductor Manufacturing.
IDMs also use foundries. Intel notes that it is one of TSMC’s top customers, with up to 20 percent of its production using external foundries. Texas Instruments reported externally sourcing 20 percent of its production in 2022 and 2023; Analog Devices externally sourcing 50 percent of its wafer requirements. STMicroelectronics subcontracted approximately 20% of the value of our total silicon production to external foundries in 2023. In 2023, approximately 63% of Microchip Technology sales came from products that were produced at outside wafer foundries. Infineon, NXP, Renesas Electronics and Onsemi also externally sourcing wafers from external foundries. Over 80 percent of IDMs reported using external production for some portion of their front-end fabrication.
This report studies the Fab-lite Semiconductor Fabrication Model, cover the "fabless to Fab-lite model" and "IDM to Fab-lite model".
fabless to Fab-lite model, key companies are Maxscend Microelectronics Company Limited, GalaxyCore, Hot Chip Technology, etc. The IDM to Fab-lite model, key companies are Texas Instruments (TI), Renesas, STMicroelectronics, Infineon, NXP, Microchip Technology, Onsemi, Analog Devices, Inc. (ADI) and Toshiba, etc.
The global Fab-Lite market size is projected to grow from US$ 340490 million in 2024 to US$ 480900 million in 2030; it is expected to grow at a CAGR of 5.9% from 2024 to 2030.
Researcher' newest research report, the “Fab-Lite Industry Forecast” looks at past sales and reviews total world Fab-Lite sales in 2022, providing a comprehensive analysis by region and market sector of projected Fab-Lite sales for 2023 through 2029. With Fab-Lite sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fab-Lite industry.
This Insight Report provides a comprehensive analysis of the global Fab-Lite landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Fab-Lite portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fab-Lite market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fab-Lite and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fab-Lite.
United States market for Fab-Lite is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Fab-Lite is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Fab-Lite is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Fab-Lite players cover Maxscend Microelectronics Company Limited, GalaxyCore, Hot Chip Technology, Suzhou Yuanxin Microelectronics Technology, Renesas, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Fab-Lite market by product type, application, key players and key regions and countries.
Segmentation by Type:
Fabless to Fab-Lite
IDM to Fab-Lite
Segmentation by Application:
Analog IC
Micro IC
Logic IC
Discrete IC
Sensors IC
Memory IC
Optoelectronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Segmentation by Type:
Fabless to Fab-Lite
IDM to Fab-Lite
Segmentation by Application:
Analog IC
Micro IC
Logic IC
Discrete IC
Sensors IC
Memory IC
Optoelectronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Maxscend Microelectronics Company Limited
GalaxyCore
Hot Chip Technology
Suzhou Yuanxin Microelectronics Technology
Renesas
Navitas
Texas Instruments (TI)
STMicroelectronics
Sony Semiconductor Solutions Corporation (SSS)
Infineon
NXP
Microchip Technology
Onsemi
Toshiba
Analog Devices, Inc. (ADI)
IDMs also use foundries. Intel notes that it is one of TSMC’s top customers, with up to 20 percent of its production using external foundries. Texas Instruments reported externally sourcing 20 percent of its production in 2022 and 2023; Analog Devices externally sourcing 50 percent of its wafer requirements. STMicroelectronics subcontracted approximately 20% of the value of our total silicon production to external foundries in 2023. In 2023, approximately 63% of Microchip Technology sales came from products that were produced at outside wafer foundries. Infineon, NXP, Renesas Electronics and Onsemi also externally sourcing wafers from external foundries. Over 80 percent of IDMs reported using external production for some portion of their front-end fabrication.
This report studies the Fab-lite Semiconductor Fabrication Model, cover the "fabless to Fab-lite model" and "IDM to Fab-lite model".
fabless to Fab-lite model, key companies are Maxscend Microelectronics Company Limited, GalaxyCore, Hot Chip Technology, etc. The IDM to Fab-lite model, key companies are Texas Instruments (TI), Renesas, STMicroelectronics, Infineon, NXP, Microchip Technology, Onsemi, Analog Devices, Inc. (ADI) and Toshiba, etc.
The global Fab-Lite market size is projected to grow from US$ 340490 million in 2024 to US$ 480900 million in 2030; it is expected to grow at a CAGR of 5.9% from 2024 to 2030.
Researcher' newest research report, the “Fab-Lite Industry Forecast” looks at past sales and reviews total world Fab-Lite sales in 2022, providing a comprehensive analysis by region and market sector of projected Fab-Lite sales for 2023 through 2029. With Fab-Lite sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fab-Lite industry.
This Insight Report provides a comprehensive analysis of the global Fab-Lite landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Fab-Lite portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fab-Lite market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fab-Lite and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fab-Lite.
United States market for Fab-Lite is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Fab-Lite is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Fab-Lite is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Fab-Lite players cover Maxscend Microelectronics Company Limited, GalaxyCore, Hot Chip Technology, Suzhou Yuanxin Microelectronics Technology, Renesas, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Fab-Lite market by product type, application, key players and key regions and countries.
Segmentation by Type:
Fabless to Fab-Lite
IDM to Fab-Lite
Segmentation by Application:
Analog IC
Micro IC
Logic IC
Discrete IC
Sensors IC
Memory IC
Optoelectronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Segmentation by Type:
Fabless to Fab-Lite
IDM to Fab-Lite
Segmentation by Application:
Analog IC
Micro IC
Logic IC
Discrete IC
Sensors IC
Memory IC
Optoelectronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Maxscend Microelectronics Company Limited
GalaxyCore
Hot Chip Technology
Suzhou Yuanxin Microelectronics Technology
Renesas
Navitas
Texas Instruments (TI)
STMicroelectronics
Sony Semiconductor Solutions Corporation (SSS)
Infineon
NXP
Microchip Technology
Onsemi
Toshiba
Analog Devices, Inc. (ADI)
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